Observed Signal · Jul 21, 2026 · Partnership · Source: CNBC Technology · Impact: 2/5 · Sentiment: Neutral
Intel foundry signs Fortinet for security chips
Intel’s foundry has secured Fortinet as a named customer to manufacture the cybersecurity firm’s next-generation security chip, SP6. Fortinet’s SP6 will be produced on Intel 4 process technology, the companies said. Fortinet is the first publicly announced corporate foundry customer under Intel CEO Lip-Bu Tan, who became CEO in March 2025. The article notes Intel’s more advanced process nodes (14A and 18A) and that Intel 4 is an older node typically used for simpler ASICs. The piece also references prior low-volume foundry relationships announced under Intel’s previous leadership and other collaborations — including work with the U.S. government, Google, Microsoft, Amazon, Tesla, SpaceX and a claimed comment about Apple — as context for Intel’s broader foundry efforts.
This is a notable commercial customer win validating Intel's foundry under new CEO Lip-Bu Tan and highlights capacity for security ASIC production, but it is not an industry-shifting announcement for the advertising/MarTech ecosystem.
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Key Takeaways & Evidence Grounding
- Fortinet will use Intel’s foundry to produce its next-generation security chip.
- Fortinet’s chip, named SP6, will be manufactured on Intel’s Intel 4 process.
- Fortinet is the first announced corporate customer for Intel’s foundry under CEO Lip-Bu Tan.
- Intel’s leading manufacturing nodes are 14A and 18A; Intel 4 is an older process geared toward simpler ASICs.
- The U.S. government and several tech companies have existing or announced low-volume engagements with Intel’s foundry.
Connected Companies & Entities
8 Entities mapped“Fortinet will use Intel’s foundry to produce its next-generation security chip, the two companies announced Tuesday, marking a win for Intel...”
“Fortinet will use Intel’s foundry to produce its next-generation security chip, the two companies announced Tuesday, marking a win for Intel...”
“Under Pat Gelsinger, Intel’s previous CEO, Microsoft announced a partnership with the chipmaker to manufacture an unspecified processor in 2...”
“Under Pat Gelsinger, Intel’s previous CEO, Microsoft announced a partnership with the chipmaker to manufacture an unspecified processor in 2...”
“In April, Intel said it would help design an ASIC with Google that it calls an infrastructure processing unit....”
“Intel is also helping Elon Musk’s Tesla and SpaceX build a chip factory called Terafab....”
“Intel is also helping Elon Musk’s Tesla and SpaceX build a chip factory called Terafab....”
“President Donald Trump said in June that Apple would use Intel to manufacture chips in the U.S., but neither company has officially confirme...”
Related Market Signals & Shifts
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Intel CEO: Foundry Business Gaining Momentum
Intel CEO Lip‑Bu Tan said the company’s external foundry business is gaining traction as manufacturing yields improve, attracting interest from outside customers. Speaking on CNBC’s Mad Money, Tan highlighted progress on Intel’s advanced 18A process and said he’s seeing monthly yield improvements consistent with best practices. He declined to name customers but said Intel expects commitments from multiple foundry customers in the second half of the year. The article notes prior reporting of a preliminary Intel‑Apple chip manufacturing agreement and references Intel’s Arizona 18A fab and a delayed Ohio project not expected to start production until at least 2030. CFO David Zinsner previously said signals from external foundry customers should become more concrete in H2 2026 and into early 2027.
Intel Near Deal to Make Apple Chips
Reports say Apple and Intel have reached a preliminary agreement that would have Intel manufacture some of Apple’s device chips. The potential deal—first reported by the Wall Street Journal and cited by CNBC—would mark a major validation for Intel’s foundry push and create a viable second source to TSMC for Apple’s most advanced chips. The article notes Intel is ramping capacity at a new Arizona fab producing on its 18A node (with an improved 18A‑P node expected later) while Apple has been solely reliant on TSMC. Analysts suggest the deal addresses wafer-capacity constraints driven by surging AI demand and could reshape advanced-node supply dynamics if finalized.
Intel Joins Musk's Terafab Chip Project
Intel has announced it will join SpaceX and Tesla’s Terafab initiative to develop a new U.S. semiconductor factory in Texas. In a corporate post on X, Intel said its capabilities to design, fabricate and package ultra-high-performance chips at scale will support Terafab’s goal to produce “1 TW/year” of compute for AI, robotics, satellites and potential autonomous vehicle/robot applications. TechCrunch notes the scope of Intel’s contributions was not detailed. The story highlights the massive cost and multi-year timeline typical of building fabs (often exceeding $20 billion) and notes Intel’s stock rose roughly 3% on the news. SpaceX and Intel did not provide further comment to TechCrunch.
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