Observed Signal · Oct 13, 2026 · Product Launch · Source: PR Newswire: Advertising & Marketing · Impact: 4/5 · Sentiment: Positive
Lightmatter Unveils CPO Switch and XPU Tray at OCP Summit
Lightmatter unveiled new co-packaged optics (CPO) systems at the 2026 OCP Global Summit, including a switch tray and an XPU tray built to Open Compute Project (OCP) specifications. The switch tray, developed with Flex, integrates eight Passage CPO BiDi engines and Guide DR laser modules, achieving 204.8 Tbps in a single rack unit. The XPU tray, with 102.4 Tbps, replaces copper backplanes with photonic interconnects and is the first to support four XPUs. Both leverage open standards and aim to accelerate adoption of silicon photonics in AI data centers. The company also highlighted vClick optics and collaborations with SENKO and Corning.
This is a significant technical advancement for AI data center infrastructure, directly impacting the scalability and efficiency of AI computing, which is foundational for AdTech's AI-driven platforms and real-time bidding systems.
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Key Takeaways & Evidence Grounding
- Lightmatter unveiled a 204.8 Tbps CPO switch tray and a 102.4 Tbps XPU tray at the 2026 OCP Global Summit.
- The switch tray was developed with Flex as a production validation platform.
- The XPU tray is the first to connect four XPUs with 102.4 Tbps of scale-up optical bandwidth in one rack unit.
- Both systems are based on OCP's Open Rack Version 3 (ORv3) and Modular Hardware System (MHS) specifications.
- The Open Silicon Photonics for AI Systems initiative now includes more than 20 companies.
Connected Companies & Entities
1 Entity mappedAdvanced materials manufacturer serving connectivity, display, life sciences and automotive markets.
“The CPO XPU tray uses expanded beam PRIZM optical connector technology from Corning Incorporated.”
Ontology Mapping & Concepts
Related Market Signals & Shifts
Recent verified developments and strategic activity across this market segment.
Co‑Packaged Optics (CPO) Primer
The article explains co‑packaged optics (CPO), a datacenter trend that integrates the optical engine onto or into the switch package to eliminate long copper traces between switch ASICs and transceivers. By moving modulation to silicon photonics and using external continuous‑wave (CW) lasers, CPO reduces the need for DSPs and high‑power SerDes, cutting power and potentially improving reliability and latency. The piece contrasts CPO with pluggable transceivers and intermediate approaches (near‑package optics), highlights manufacturing and serviceability tradeoffs, and notes industry momentum — Nvidia plans CPO shipments in 2026, Broadcom and Marvell are active in early programs, and value is shifting toward silicon photonics, CW laser supply, and advanced packaging while reducing demand for pluggable DSP modules.
Co‑Packaged Optics (CPO) Arrives for Datacenter Interconnect
SemiAnalysis presents an in‑depth technical and commercial analysis of co‑packaged optics (CPO) for datacenter networking, arguing CPO will be commercially relevant starting in 2025 and will be the primary scaling path for scale‑up AI interconnects later this decade. The report compares CPO to pluggable transceivers and co‑packaged copper, quantifies power and TCO tradeoffs (including published Meta and SemiAnalysis estimates showing big per‑800G power reductions), and reviews product roadmaps and early deployments from Nvidia and Broadcom. It examines critical enabling technologies and supply‑chain elements (optical engines, modulators, laser sources, fiber attach units, TSMC COUPE packaging), reliability and serviceability concerns, and vendor strategies. The piece concludes scale‑up networking is the “killer” CPO use case, while scale‑out adoption will initially be limited until manufacturing, standards, and field reliability mature.
Linktel Showcases 1.6T LPO Breakthrough at OCP Summit
At the OCP Global Summit 2026, Linktel Technologies showcased its 1.6T Linear Pluggable Optics (LPO) solutions for AI data centers, highlighting ultra-low power consumption of 10W, minimal latency, and supply-chain resilience. The 1.6T LPO 2DR4 module attracted significant customer interest. Linktel also demonstrated its 12.8T liquid-cooled XPO, 6.4T/7.2T NPO modules, and DMD technology. Volume production is already in place. Dr. Grace Zhang presented on dispersion-managed transceivers. Linktel is open to sharing its US patents to drive ecosystem adoption.
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