TSMC, Samsung commit to ASML's High NA EUV chip tools
TSMC and Samsung, the world's top chipmakers, have committed to using ASML's High NA extreme ultraviolet (EUV) lithography machines for future chip production, driven by growing demand for AI applications. Samsung plans to use the machines for DRAM memory production starting in 2028, while TSMC expects to adopt the technology for advanced chips around 2030. These tools cost about $400 million each. The announcements provide clarity for ASML's future growth, with investors seeing broader adoption as key. Intel already uses the technology. ASML plans to increase EUV capacity by about 30% in 2027. TSMC and Samsung will also join an initiative to advance next-generation 12-inch photomask technology, improving productivity and reducing costs.
- •Samsung will use ASML's High NA EUV machines for DRAM production from 2028.
- •TSMC will adopt High NA EUV technology in 2030 for advanced chips.
- •ASML's High NA EUV machines cost approximately $400 million each.
