Observed Signal · Sep 22, 2026 · Funding · Source: Tech.eu (European Tech & Deals) · Impact: 3/5 · Sentiment: Positive
Lightspring Raises €3.5M for Photonic Chip Manufacturing
French startup Lightspring has secured over €3.5 million in financing, including a €3.1 million seed round led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and business angels, plus a €350,000 grant from France's i-Lab competition. The Besançon-based deeptech company uses 3D lithography (two-photon polymerization) to manufacture optical coupling structures directly on photonic integrated circuits, targeting coupling losses below 0.5 dB per interface and aiming to reduce packaging costs, which currently account for about 50% of a PIC's cost. The funding will support the development of a Process Design Kit, expand the team to 12, and qualify the fabrication process for industrial use, particularly for co-packaged optics in AI infrastructure. The technology originates from research at FEMTO-ST Institute.
Significant funding for photonic chip manufacturing technology that could enhance AI infrastructure efficiency, though not directly AdTech-specific but relevant to tech infrastructure.
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Key Takeaways & Evidence Grounding
- Lightspring raised €3.1 million in a seed round led by Atlantic and OVNI Capital, with participation from Concept Ventures, Ixcore, Plug and Play Ventures, and business angels.
- Total financing exceeds €3.5 million, including a €350,000 grant from France's i-Lab competition.
- Lightspring uses 3D lithography (two-photon polymerization) to fabricate optical coupling structures directly on photonic integrated circuits, targeting coupling losses below 0.5 dB per interface.
- Optical packaging accounts for about 50% of a photonic chip's cost, and the technology aims to reduce this.
- The funding will expand the team to 12, develop a Process Design Kit, and qualify the fabrication process for industrial use, especially for co-packaged optics in AI infrastructure.
Connected Companies & Entities
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