Danske Spil

Danske Spil updates 2025 key figures on About page

The About page shows updated 2025 statistics: customer care contacts increased from 1,476 to 6,104, phone contacts from 425 to 1,757, total societal contribution from 328 million to 13 billion, and lottery funds from 186 million to 0.8 billion. The description of lottery funds now includes 'natur' (nature) alongside sports, culture, and associations. The main heading 'Der er en grund til, at vi hedder Danske Spil' was removed.

Advanced Packaging Could Be Next AI Chip Bottleneck

Advanced semiconductor packaging — the step that integrates dies into modules that interface with systems — is emerging as a potential bottleneck for AI hardware because nearly all advanced packaging capacity is concentrated in Asia and demand is surging. TSMC says its CoWoS (Chip on Wafer on Substrate) packaging is growing rapidly (about an 80% CAGR) and Nvidia has reserved the majority of the most advanced capacity. TSMC is building new packaging sites in Taiwan and two facilities in Arizona, but currently ships 100% of chips to Taiwan for packaging. Intel also provides advanced packaging (EMIB, Foveros) and lists customers including Amazon and Cisco; Elon Musk has tapped Intel to package custom chips for SpaceX, xAI and Tesla. Memory makers (Samsung, SK Hynix, Micron) and OSATs like ASE and Amkor are expanding packaging capacity to meet demand.

Ny spilaftale sætter barren for ansvarlighed højere

24. oktober 2025 I dag er der landet en politisk aftale på spilområdet ved navn Spilpakke 1 – et mere ansvarligt spilmarked. I Danske Spil er vi glade for, at det er en bred aftale med fokus på at forebygge og begrænse spilleproblemer – det er en ambition, vi deler.